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CST Microwave Studio 2012: Free Download Software for 3D EM Simulation



The easy way is a GUI, which is based on the CSTDataExport class. You can download the executable ( CSTDataExport.exe) and all you need to do in addition, is to add the CST installation directory to your PATH variable, meaning the dll files mentioned above need to be found by the program. You can check your path variable e.g. in a powershell using the command $ENV:PATH. If you want to add the CST path use the Control Panel in Windows and search for "environment" and you will find a System tool called something like "Edit environment variables for your account". Here you can add your own Path variable. Furthermore, you need to have Visual C++ Redistributable for Visual Studio 2012 installed. A screen shot of the GUI is shown in the picture below.




cst microwave studio 2012 free download software



Ansys Electronics Desktop Student offers free access to the industry gold-standard Ansys simulators for work with antenna, RF, microwave, PCB, IC and IC package designs, along with electromechanical devices such as electric motors and generators. Students will have access to Ansys HFSS, Ansys Maxwell, Ansys Q3D, and Ansys Icepak, allowing design work on a broad range of electrical and electromechanical systems. Ansys HFSS is a multipurpose, full-wave 3D electromagnetic (EM) simulation software. Ansys Maxwell is a 3D electromagnetic simulation solver for electric machines and electromechanical devices. Ansys Q3D Extractor calculates the parasitic parameters of resistance, inductance, capacitance and conductance (RLCG) for electronics designs. Ansys Icepak is a computational fluid dynamics (CFD) solver for electronics thermal management.


Metamaterials having high dispersion and nonlinearity fall into category of electromagnetic band gap arrangement, whose periodicity can be change less than calculated wavelength of given resonant frequency. Such structures are different from LH (left handed) metamaterials and widely known as anisotropic or none resonating or PBG (photonic band gap) structures [11] [12] . Several works have been performed based on PBG structures and are undergoing as to get more and more bandwidth at high frequency. PBG structures are basically the arrangement of crystals (especially semiconductor) to control the propagation of electromagnetic waves [11] [12] . Electrons behave like a wave for periodic struc- tures according to the quantum mechanics. Similar to LHM, periodic structure that can influence on the electro magentic waves was given different names: photonic crystals (PC), photonoc band gap (PBG), electromagnetic band gap (EBG), microwave band gap (MBG), or simply periodic structure. It is also found in 1D, 2D and 3D according to the usage. The most important part of PBG structures are defect [13] , which disturbing the periodicity of periodic structures. On account of this, the propagation of electromagnetic waves, pass through the resonant cavity, where defect treated as a cavity. It forms free frequency mode inside the forbidden band-gap during transmission. PBGs can be used for any frequency range, start from radio frequency (RF) to X-rays. Mostly, it is being used in optics and microwaves and they have the most applicable results, but with specific problems according to the nature of the medium and its interaction with electromagnetic waves.


Comparative analysis has been performed between metamaterial and PBG based structure for frequency approximately 44 GHz and results related to this work are properly shown using commercial software CST microwave studio. Parameters have been decided using all equations in Section III, and have been kept same for both design. For metamaterial based antenna design, array of inverted U has been taken to check the compatibility with 5G advance cellular system technology. For PBG, rods have been taken, putting at equal periodicity. Parameters are considered according to the resonant frequency given in Table 1.


One of the important parameter is VSWR, which proposed antenna compatibility with transmission from input to output and gives information about reflection from output in form of standing wave ratio. Ideal value of VSWR is one, which can be achieved only on zero reflection, which is not possible in case planar antennas. Figure 5(a) and Figure 5(b) show the value of VSWR at the resonant frequencies. It is very clear from plots, the VSWR is better in case of metamaterial antenna. In the plot, passes have been taken during simulation to get more accurate results under CST microwave studio.


From entire analysis, it has been understood that metamaterial based antennas is more useful for 5 G advanced communication systems, with proper results and its discussion. The metamaterial inverted U shape antenna has more impact in terms of return loss, VSWR, gain and bandwidth compared with PBG planar antennas. And it is also easy to fabricate for experimental analysis. Efficiency is better in case of metamaterial based antenna as calculated 79%. But, all results obtained here, are simulated one using CST Microwave studio (Version 2012), but not measured from VNA. This has to be done in future.


A supported hotfix is available from Microsoft Support. However, this hotfix is intended to correct only the problem that is described in this article. Apply this hotfix only to systems that are experiencing the problem described in this article. This hotfix might receive additional testing. Therefore, if you are not severely affected by this problem, we recommend that you wait for the next software update that contains this hotfix.If the hotfix is available for download, there is a "Hotfix download available" section at the top of this Knowledge Base article. If this section does not appear, contact Microsoft Customer Service and Support to obtain the hotfix. Note If additional issues occur or if any troubleshooting is required, you might have to create a separate service request. The usual support costs will apply to additional support questions and issues that do not qualify for this specific hotfix. For a complete list of Microsoft Customer Service and Support telephone numbers or to create a separate service request, go to the following Microsoft website:


Here, the correction factor, \(K_g = 0.57 - 0.145 \ln \fracw^\prime h^\prime \) , in which \(w^\prime \) and \(h^\prime \) are represent the substrate width and thickness, respectively. Moreover, \(t, l,\) and \(w\) denote the thickness, length, and width of microstrip lines, respectively. The projected MTM structure conceives a square outer ring that is split twice. An equivalent circuit is considered in Fig. 8, in which this outer ring is presented by a group of inductances and capacitances, namely L1, L2, L3, L4, L5, L6, L15, and L16. This inductance resembles the effects of copper for different segments of the outer rings, whereas capacitors C1 and C2 are due to the split gaps in this ring. This ring is an interconnector with two modified E-shaped metal strips that are presented with the equivalent inductances L7, L8, L9, L10, L11, L12 in distribution form like the line inductances in a transmission line. The middle of the I-like-shaped structure equates with the inductance L13, L14, and as the I-like shape is connected with two E-shaped structures, a short circuit is employed in the middle of the equivalent circuit. Moreover, inductance L17 characterizes the corresponding inductance between E outer ring and internal structure. The co-planar capacitances that exist between the outer ring and internal structures are symbolized by the capacitances C3, C4, C5, and C6. The equivalent circuit is justified through the simulation in Advanced Design System (ADS) and comparing the result obtained from this with the output obtained in CST microwave studio. In ADS, two ports are connected at two ends of the circuit, including 50 Ω terminating impedances, as shown in Fig. 1. Initially, component values are considered 1 nH for each inductor and 1 pF for each capacitor. Then, the component values are adjusted using the tuning module of ADS to attain the similar S21 response of MTM simulation in CST, and thus, the component values are finalized. Figure 9 shows a comparison plot of S21 that describes the nature of the transmission coefficient acquired from circuit simulation and MTM simulation. A close similarity is noticed between the two responses; thus, the equivalent circuit in Fig. 1 with component values replicates the MTM unit cell present in this manuscript.


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